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OmniScan MX ECA/ECT

Performs eddy current testing inspections using eddy current probes in the aerospace, automotive, petrochemical, and power generation industries in the detection of surface or near-surface defects in materials such as aluminum, stainless steel, copper, titanium, brass, Inconel, and even carbon steel (surface defect only).
     

Описание:



The OmniScan MX 
A Field-Proven, Dependable Instrument

OmniScan MX Aero

With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.

The highly legible 8.4 in. (213 mm) real-time color display of the OmniScan MX enables you to see defects and details under any light conditions. Navigate your way through the instrument’s simple and intuitive interface using the scroll knob and function keys, or by connecting a USB mouse to facilitate the inspection analysis.

OmniScan MX

One Platform, Two Modules, Three Technologies: More Flexibility

To meet the requirements of a broader range of applications, eddy current testing (ECT), eddy current array (ECA) and the new bond testing (BT) C-scan technology are available in two module versions. Both of these modules are compatible with the MXE (ECT/ECA) and MXB (BT C-scan) software, providing easy transition between technologies and a very short learning curve.

EC Surface ProbeECA ProbeBond Testing C-Scan
OmniScan MX Modules

Conventional ECT

Eddy Current Array

Bond Testing C-Scan

ECT4 module

Not supported

ECA4-32 module

Most Nortec probes supported

Supports 32 onboard channels and 64 channels with external multiplexer

Requires special adaptor and scanner

ECA is just like ECT 
Large Coverage, Fast Scanning, and Higher Probability of Detection

OmniScan MX Aero

Eddy current array (ECA) technology incorporates several traditional bridge or reflection (driver-pickup) probe coils in order to achieve a much larger coverage in a single inspection pass. Additionally, each ECA probe model is carefully designed to maintain a high probability of detection of a targeted defect range, all along the probe length. With the OmniScan® MX ECA, you can use ECA probes at fast manual-inspection speeds, offering a powerful and productive inspection with color representation and archiving capability.

Principe
Single coil: raster scanning
Array probe: one-line scanning

Inspection through Thin Coatings

Eddy current testing (ECT) technology works on the principle of magnetic coupling of a probe sensor (coil) close to a test specimen (conductive material, ferromagnetic or non-ferromagnetic), generating eddy currents inside the test specimen, and displaying signals on the instrument’s impedance plane. With eddy current technology, you can detect defects through thin coatings (such as paint), as long as the distance from the probe to the metal is kept reasonably low—typically in the order of 0.5 mm to 2.0 mm.

As eddy current array and ECT technology share the same basic principles (and physics), it can also perform inspections through paint while offering all advantages of ECA, including large coverage, fast scanning, high probability of detection and color imaging.

Inspection through Thin Coatings

Probes used to perform eddy current inspections are made with a copper wire wound to form a coil. The coil shape can vary to better suit specific applications.

  1. The alternating current flowing through the coil at a chosen frequency generates a magnetic field around the coil.
  2. When the coil is placed close to an electrically conductive material, an eddy current is induced in the material.
  3. If a flaw in the conductive material disturbs the eddy current circulation, the magnetic coupling with the probe is changed and a defect signal can be read by measuring the coil impedance variation.

Increased Power, Decreased Complexity 
MXE 3.0 Software

With the exception of the added capacity to electronically switch between elements, eddy current array (ECA) technology is essentially the same as ECT technology. Eddy current array is easy to operate and calibrate. The new OmniScan MXE 3.0 ECA software has been redesigned to facilitate the transition from a conventional ECT instrument (such as the Olympus Nortec® 500) and to offer the power of ECA in a much more accessible way.

Nortec 500
OmniScan ECA
Single channel ECT
32 simultaneous channels
Nortec 500 Main Menu
OmniScan MXE 3.0 new Main menu
Nortec 500 Main menu
OmniScan MXE 3.0 new Main menu

Live Impedance Plane

Calibration of ECA is done in a nearly identical fashion as conventional ECT. The principles of lift-off, gain and null adjustments are maintained so calibration is no more complex or time-consuming than usual.

Live Impendance Plane

Generate live lift-Off signals with ECA probe – just like with a conventional ECT probe.

Adjust the phase angle in real time with the OmniScan knob. Gain, Vertical Gain and Null Point (H/V) can also be adjusted the same way.

Replacement of Traditional NDT methods 
Paint Removal is Obsolete

Eddy current array has a unique ability to perform inspections through thin coatings on conductive material. This capability provides a tremendous advantage over existing methods, such as penetrant testing, magnetic particle or magneto-optical imaging (MOI), as the need to remove and then reapply paint or coating is eliminated completely. Over time, this provides you with enormous cost-savings, and most importantly, your inspections will be chemical-free.

Penetrant Testing

ECA Stress Corrosion

Part inspected with Penetrant Testing (visible red dye)

Scan using a standard ECA probe that features the same color representation as the red dye PT (patent rights protected). The sensitivity can be adjusted to reveal more or fewer defects.

Key Advantages:

  • No need for paint removal.
  • Imaging and archiving.
  • One-step inspection, high scan speed, and instant results.
  • Major time-savings (typically 10:1 and over).
  • Drastically reduced turnaround time.
  • Defect depth evaluation capability.
  • Adjustable sensitivity and post-process analysis.
  • Environment-friendly method (no chemicals involved).

A Variety of Familiar Color-Palette Choices, Offering More Possibilities

The MXE 3.0 ECA software features a range of patent-rights-protected color-palette representations that replicate the look of traditional NDT methods and facilitate the intuitive display of ECA signals.

OS_ECA_SCC_04.psd

OS_ECA_SCC_03.psd

OS_ECA_SCC_02.psd

Penetrant Testing (fluorescent)

Magnetic Particle (red powder)

Magnetic Particle (fluorescent)

Analyzing, Reporting, and Archiving 
Confirm or Revisit Inspections after Completion

Even after an in-field inspection has been completed, the OmniScan® MX ECA continues to provide value thanks to integrated data-storage, analysis, and reporting functionalities. With the OmniScan MX ECA you can review individual indications and apply corrections as needed. The new MXE 3.0 ECA software features newly redesigned, intuitive data cursors that can be operated directly from the instrument (on-site) or with a mouse connected by USB (office use).

OS_ECA_SCC_05.psd

OS_ECA_SCC_06.psd

New MXE 3.0 selection cursors are very intuitive and allow to quickly select any indication.

Corrections can be easily done on recorded data. Above example shows gain (contrast) adjustment.

Instant Reporting and Easy Archiving

The OmniScan MX features built-in reporting, at the touch of a key. Reports can also be configured and customized by advanced users. However, the factory-default report format already includes a screen shot and carefully selected, preloaded data fields that aim to eliminate the need for customization.

Archiving of inspection data files is also very easy; at any time (during acquisition or analysis), a single press of a key will instantly store the data on the instrument memory card.

MX Report

Perform data analysis quickly and efficiently with mouse input. Archive files to a PC with the help of a CompactFlash reader.

Encoded Scans for Easier Data Interpretation 
Optimized 1-2-3 Calibration

The OmniScan® MX ECA not only displays ECA signals in a conventional ECT impedance plane view but also offers several other views and layouts where the user will begin to recognize the true power of encoded ECA technology. These displays can be made part of the calibration workflow and can make eddy current testing highly visual and even go/no-go, based on user defined acceptance criteria.

Thanks to its intuitive interface design, the OmniScan MX ECA is quick and easy to configure and operate. It is as simple as one, two, three.

1 Adjust the usual ECT controls in real time using the live impedance plane.

2 Activate the encoder and C-scan display.

3 Fine-tune the settings and get ready to perform the inspection.

OS_ECA_Surface_02.psd

OS_ECA_Surface_03.psd

OS_ECA_Surface_04.psd

 
 

Contrast adjustment using the gain in full C-scan display.

Continuous Encoder Mode

The advantage of time-based inspection is its virtually unlimited scanning capacity with minimal instrument interaction, whereas the benefit of encoded scans (C-scan images) is the ability to produce valuable color-coded images and information related to flaw position, shape, and dimensions.

OmniScan MX Aero

The MXE 3.0 ECA software introduces a new Continuous Encoder mode that enables encoder-corrected imaging while maintaining the user-friendliness of a time-based inspection. With this mode, inspections are highly productive, with indications being recorded at your discretion.

Powerful Color Imaging 
Estimation of Flaw Depth with Color-Coded C-Scans

As with conventional eddy current technology, flaw severity is closely correlated to the return EC signal amplitude in most surface or near-surface applications. By using an amplitude-based color code, and plotting each channel’s return signal with encoded-position information, the resulting C-scan display is highly visual and intuitive. These scans can be saved to the removable CF card or generated into a report onboard the OmniScan® MX.

Sonde_CFA_SAA112_04.psd

OS_ECA_Corrosion_04.psd

OS_ECA_Corrosion_05.psd

A reference standard with known depth defects is necessary to calibrate the sensitivity and contrast of ECA.

Image of a calibrated ECA scan showing different colors for each defect depth range.

Actual aircraft skin showing corrosion indications. The colors indicate the depth of the defects.

Accept or Reject Flaws Based on Threshold

With the OmniScan MX ECA, you can accept or reject indications based on the C-scan color display. The MXE 3.0 ECA software contains a wide range of factory-tested color palettes that optimize the signal display for any ECA application.

Additionally, the new C-scan alarm feature simplifies the gating of reject signals, as it instantly changes the C-scan colors when the impedance plane signal enters the alarm zones.

OS_ECA_goNogo_02.psd

OS_ECA_goNogo_03.psd

OS_ECA_goNogo_01.psd

A variety of application-specific color palettes come preloaded with the new MXE 3.0 ECA software 
(patent rights protected).

With the alarm feature, the C-scan changes color whenever a signal enters the reject zone.

OmniScan MX in ECT Mode, a Powerful Flaw Detector 
The Power of ECA and ECT combined

Some inspection procedures may specifically require ECT while ECA can easily help you cut time and find problem areas. With the OmniScan® MX ECA, you don’t need to commit to just one technology at the start of an inspection. Pressing and holding the menu key anytime during an inspection allows for instant switching between ECA and ECT modes. Both probes can remain connected and configuration setups remain active.

Connection

Simultaneous connection of ECA and ECT probes provides the best tool for the job without the need to stop and reconfigure your hardware setup

OS_ECA_Interface_01.psd

OmniScan_Bouton_Menu.ai

Press and hold menu key…

OS_EC_Interface_01.psd

ECA interface (blue) is as easy to use as the ECT mode or a Nortec 500.

 

ECT interface (green) includes several features for procedure compatibility, such as adjustable null position.

High Quality Signals, Existing Probes

OS EC Surface

The OmniScan MX in ECT mode includes a high quality signal digitizer and all-digital signal processing chain for minimal signal loss or distortion. This, combined with its bright, large display, makes the OmniScan MX in ECT mode one of the world’s finest ECT flaw detectors, displaying high-quality signals every time.

ECT Probes

The OmniScan MX in ECT mode also allows the use of most existing Nortec® ECT probes, through the use of new cables and adaptors.

OmniScan_MX_ECA_BondTesting_01.psd

Контроль прочности композитных материалов

Использование до 8 частот

BondMaster1000EPLUS_02_Ombre.psd

Усовершенствованный метод контроля композитных материалов

  • Развертка С-скан
  • Использование до восьми частот одновременно
  • Функция определения размеров
  • Улучшенное обнаружение дефектов
  • Режим отображения фаза/амплитуда

Важные примечания

  • Возможности обнаружения аналогичны BondMaster® 1000e+, при использовании тех же преобразователей
  • Поддержка раздельно-совмещенных преобразователей
  • Для создания C-скан развертки необходим двухосевой сканер с кодировщиком

Усовершенствованный контроль композитных материалов

Компания Olympus с гордостью сообщает о выпуске нового решения OmniScan® для контроля композитных материалов, что несомненно является большим шагом вперед в развитии данной области. Удобочитаемое двумерное изображение C-скан теперь доступно и с портативным прибором. Новое решение OmniScan идеально подходит для обнаружения расслоений и нарушения связи между слоями в композитных материалах. Данная технология предназначена главным образом для эксплуатационного контроля в аэрокосмической промышленности, но также используется в производственном секторе, включая автомобиле- и судостроение (например, для выявления дефектов в корпусах судов, изготовленных из композици­онных материалов).

OmniScan_Composite_WING_01.psd

Пользователям, уже приобретшим OmniScan® с модулем ECA или ECT, необходимо просто заказать стандартные преобразователи BondMaster® (P14 и SPO-5629), а также кабель BondMaster для выполнения контроля.

Программное обеспечение MXB, выполненное с учетом требований наших клиентов, – усовершенствовано и адаптировано для контроля композитных материалов; новые функции ПО (такие как: мастер настройки и нормализация) обеспечивают простоту эксплуатации.

A%c3%a9ro_BondTesting_02.psd

Система кодировки: любой двухосевой сканер (кодировщик) может быть использован для контроля качества изделия. Olympus предлагает два варианта: сканер GLIDER™, использующийся для контроля плоских и слегка изогнутых поверхно­стей; и сканер WING™, который предназначен для сканирования криволинейных изделий (например, фюзеляжи самолетов) и может использоваться в перевернутом положении с помощью вакуумной присоски Venturi. Для большей гибкости, можно также использовать портативный одноосевой сканер (кодировщик) с индексатором.

Качественное изображение C-скан

Еще одно нововведение от компании Olympus: новый способ отображения данных на экране. Для каждой C-скан развертки оператор может выбрать один из двух режимов отображения: C-скан амплитуды показывает изменения цветового тона на основе амплитуды сигнала, вне зависимости от фазы, что обеспечивает качественное изображение при контроле прочности компо­зитных материалов. Фазовый C-скан использует цветовую палитру от 0° до 360° для отображения изменений фазового угла, позволяя быстро распознавать различные сигналы (наличие шпатлевки или расслоения).

Фазовый C-скан, курсор на заливке

OS_BondTesting_55.psd

OS_BondTesting_53.psd
OS_BondTesting_56.psd
OS_BondTesting_52.psd
Низкочастотное сканирование; курсор C-скана амплитуды над расслоением
Высокочастотное сканирование; фазовый C-скан, отличная цветовая палитра
Высокочастотное сканирование; фазовый C-скан, курсор над расслоением
OS_BondTesting_65.psd
OS_BondTesting_69.psd
OS_BondTesting_57.psd
Два режима отображения C-скан
Развертка C-скан в полноэкранном режиме
Функция определения размеров дефектов

Необходимое оборудование

Представленное решение доступно в двух конфигурациях и требует наличия стандартных комплектующих.

Стандартные комплектующие

OmniScan_2003_08.psd
OS_BondTesting_53.psd
BondTester_Probe_03.psd
OmniScan MX и модуль ECA/ECT
Программное обеспечение MXB
Адаптер преобразователя BondMaster для OmniScan

Механическая конфигурация

Scanner_BondTesting_02.psd

Портативный сканер HSB-01

Полу-автоматическая конфигурация

Scanner_Glider_04.psd
Двухосевой сканер
BondTester_Probe_01.psd
BondTester_Probe_02.psd
Преобразователь SPO-5629-PHV и держатель преобразователя ACIX1520
Преобразователь S-PC-P14 и держатель преобразователя ACIX1519

ХАРАКТЕРИСТИКИ:

OmniScan MX
Overall dimensions 
(W x H x D)
321 mm x 209 mm x 125 mm (12.6 in. x 8.2 in. x 5.0 in.)
Weight4.6 kg (10.1 lb), including module and one battery
Display21 cm (8.4 in.) TFT LCD Display, 800 pixels x 600 pixels, 16 million colors
Power supplySmart Li-ion batteries (up to 2), and DC-in voltage 15 V to 18 V (min. 50 W)
Battery LifeMinimum 6 hours with two batteries; minimum 3 hours per battery under normal operating conditions
Data storageCompactFlash card, most standard USB storage devices, or through fast Ethernet, internal 32-MB DiskOnChip
I/O ports3 USB ports, Video output Video out (SVGA), Ethernet 10/100 Mbps, 2-axis encoders, 4 digital inputs (TTL).
Operating temperature range0 °C to 40 °C; 0 °C to 35 ºC with 32:128 PA (32 ºF to 104 ºF; 32 ºF to 95 ºF with 32:128 PA)
Storage temperature range–20 °C to 70 °C (–4 ºF to 158 ºF) Relative humidity 0 % to 95 % noncondensing. No air intake; splashproof design.
MX Module Compatibility
OMNI-M-ECT4Supports conventional eddy current and bond testing C-scan (adaptors not included)
OMNI-M-ECA4-32Supports eddy current arrays, conventional eddy current, and bond testing C-scan (adaptors not included)
ECT/BT and ECA modules
ConnectorsBNC Absolute Probe (ECT), 4-channel Universal Fischer 19 pins (ECT and BT), and OmniScan connector for ECA probes
Number of channels1 to 4 (ECT); 32 (ECA), expandable up to 64 with external multiplexer; 1 (BT) with adaptor
Probe compatibilityAbsolute, differential, bridge, reflection (driver-pickup) for both ECT and ECA probes. 
Support select BondMaster pitch-catch probes through use of an adaptor (scanner also required).
Probe recognitionAutomatic probe recognition and setup for ECA and BT probes.
Frequencies2 typical for most ECA and ECT setups or up to 8 on custom ECT applications or Bond Testing C-scan
Operating frequency20 Hz to 6 MHz
Maximum voltage12 Vp-p into 10 Ω
GainECT and ECA: 34 dB to 74 dB. BT: 28 dB to 68 dB. Additional adjustable software gain of 0 dB to 30 dB.
Phase rotation0° to 360° with increments of 0.1°
Acquisition (measurement) rate1 Hz to 15 kHz, variable depending on configurations.
A/D resolution16 bits
FilteringFIR low-pass, FIR high-pass, FIR band-pass, FIR band-stop (adjustable cutoff frequency), median filter (variable from 2 points to 200 points), mean filter (variable from 2 points to 200 points)
Channel processingTrue automatic mixing, sensitivity normalization and encoder calibration
EncodersTime-based, one line scan or raster scan (2 axis)
Alarms3 alarms, each configurable as Pie, Box, Ring/Circle. Alarm output as Visual, TTL and Sound.
Analog outputsYes - one channel only.
ХА


Передовые решения неразрушающего контроля

Контроль сварных соединений Коррозионный мониторинг Технология направленных волн Aerospace Inspection Solutions Stress Corrosion Cracking Solutions Контроль композитных материалов Промышленные сканеры Экспресс-диагностика трубопроводов

Дефектоскопы

Портативные ультразвуковые дефектоскопы Вихретоковые дефектоскопы Оборудование с фазированными решётками BondTesting Матричные вихретоковые дефектоскопы Технология направленных волн Генераторы-приёмники Датчики и преобразователи

Интегрированные системные решения в области НК

Контрольно-измерительные системы
Системы диагностики прутков Системы диагностики трубопроводов

Толщиномеры

Преобразователи и комплектующие

Компоненты микроскопов

Modular Microscope Assemblies Optical Microscope Frames Optical Microscope Modules

Оптические измерительные системы

Лазерные конфокальные микроскопы Опто-цифровые микроскопы

Видеоскопы, бороскопы

Видеоскопы Промышленные фиброскопы Стандартные жёсткие бороскопы Программное обеспечение для генерации отчетов Источники света Системы прокрутки

Высокоскоростные видеокамеры

Анализаторы XRF и XRD

Настольные XRD/XRF анализаторы
Переносной XRF-анализатор Портативный XRF-анализатор DELTA Портативный дифрактометр (XRD) Промышленный XRF-анализатор Тестовый стенд XRF

Микроскопия

Semiconductor & Flat Panel Display Inspection Инвертированные металлургические микроскопы Лазерные конфокальные микроскопы Модульные микроскопы Объективы Опто-цифровые микроскопы Поляризационные микроскопы Программное обеспечение для анализа изображений Прямые металлургические микроскопы Стерео микроскопы Цифровые камеры

Применение НК

Техподдержка